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| Product Name: |
MIJING Z20 Pro middle layer reballing platform
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| Supply Ability: |
10000000pcs |
| Related proudcts |
planting platform, |
| Specifications |
15*15*15cm |
| Price Term: |
FOB,CNF,CIF,others |
| Port of loading: |
shenzhen |
| Minimum Order |
1 |
| Unit Price: |
$26.99 |
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MJ Z20 Pro iPhone motherboard middle layer frame tin planting platform with stencil steel mesh for iPhone X-14 Pro Max motherboard soldering repair.
Product Features:
iPhone X-14 PRO MAX BGA reballing fixture tool.
Used for positioning and reballing iPhone X-14 Pro Max PCB BGA parts.
Convenient and faster for reballing BGA without any damage.
Offer you best solution for iPhone X-14 Pro Max BGA reballing and repairing.
How to install:
Install the iPhone X-14 Pro Max main board on the platform
Cover the iPhone X-14 Pro Max BGA reballing stencil on mainboard
Evenly spread tin on the cover of the reballing stencil
Remove the reballing stencil cover
Take out the motherboard and cooperate with the hot air gun to solidify the tin point. |
| Company: |
Shenzhen weixiu technology Co.,Ltd
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| Contact: |
phonefix Nicole2 |
| Address: |
JuGuang E-commerce Industrial Park, Building 8, No.9 Qilin Road, BanTian Street, LongGang District, |
| Postcode: |
518116 |
| Tel: |
+86 0755-21005627 |
| Fax: |
+86 0755-21005627 |
| E-mail: |
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